Kulicke and Soffa Industries Incのファンダメンタルズは比較的安定です。業界をリードするESG開示とともに。成長の可能性は高いです。バリュエーションは適正価格と評価されています。半導体 & 半導体製造装置業界での順位は104中11位です。機関投資家保有率は非常に高いです。過去1か月間に複数のアナリストが買いと評価し、最高目標株価は64.00とされています。中期的には、株価は上昇トレンドと予想されます。この1か月間、同社は株式市場で好調なパフォーマンスを示しており、これは強いファンダメンタルズとテクニカルに裏付けられています。株価は支持線と抵抗線の間で横ばい推移しており、レンジ相場でのスイングトレードに適しています。
Kulicke and Soffa Industries Incのスコア
関連情報
業界内順位
11 / 104
全体ランキング
83 / 4521
業種
半導体 & 半導体製造装置
サポートラインとレジスタンスライン
会社から関連データがまだ開示されていません。
レーダーチャート
現在
前回値
メディア報道
過去24時間
報道レベル
非常に低い
非常に高い
中立
Kulicke and Soffa Industries Incの注目ポイント
強みリスク
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and selling ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment are in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and selling ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment are in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.