ChipMOS Technologies Inc's fundamentals are relatively very healthy, with an industry-leading ESG disclosure.and its growth potential is high.Its valuation is considered fairly valued, ranking 78 out of 104 in the Semiconductors & Semiconductor Equipment industry.Institutional ownership is very high.In the medium term, the stock price is expected to trend up.Despite a weak stock market performance over the past month, the company shows strong fundamentals and technicals.The stock price is trading sideways between the support and resistance levels, making it suitable for range-bound swing trading.
ChipMOS Technologies Inc's Score
Industry at a Glance
Industry Ranking
78 / 104
Overall Ranking
378 / 4521
Industry
Semiconductors & Semiconductor Equipment
Support & Resistance
Relevant data have not been disclosed by the company yet.
Score Analysis
Current score
Previous score
Media Coverage
Last 24 hours
Coverage Level
Very Low
Very High
Neutral
ChipMOS Technologies Inc Highlights
StrengthsRisks
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
High Dividend
The company is a high dividend payer, with the latest dividend payout ratio of 61.46%.
Stable Dividend
The company has regularly paid dividends over the past 5 years, with the latest dividend payout ratio of 61.46%.
Overvalued
The company’s latest PB is 1.53, at a high 3-year percentile range.
Institutional Selling
The latest institutional holdings are 2.25M shares, decreasing 15.62% quarter-over-quarter.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.