ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Ticker SymbolIMOS
Company nameChipMOS Technologies Inc
IPO dateApr 19, 2013
CEO- -
Number of employees- -
Security typeDepository Receipt
Fiscal year-endApr 19
AddressNo.1, Yanfa 1st Road, Hsinchu Science Park
CityBAOSHAN
Stock exchangeNASDAQ OMX - NASDAQ BASIC
CountryTaiwan
Postal code300
Phone88635770055
Websitehttps://www.chipmos.com/
Ticker SymbolIMOS
IPO dateApr 19, 2013
CEO- -