ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
High Dividend
The company is a high dividend payer, with the latest dividend payout ratio of 61.46%.
Stable Dividend
The company has regularly paid dividends over the past 5 years, with the latest dividend payout ratio of 61.46%.
Overvalued
The company’s latest PB is 2.92, at a high 3-year percentile range.
Institutional Selling
The latest institutional holdings are 2.23M shares, decreasing 12.47% quarter-over-quarter.
Held by James Simons
Star Investor James Simons holds 0.00 shares of this stock.
Higher Market Activity
The company has more investor interest, with a 20-day turnover ratio of 2.38.