ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
企業コードIMOS
会社名ChipMOS Technologies Inc
上場日Apr 19, 2013
設立日1997
最高経営責任者「CEO」- -
従業員数- -
証券種類Ordinary Share
決算期末Apr 19
本社所在地No.1, Yanfa 1st Road, Hsinchu Science Park
都市BAOSHAN
証券取引所Iraq Stock Exchange
国Taiwan
郵便番号300
電話番号88635770055
ウェブサイトhttps://www.chipmos.com/
企業コードIMOS
上場日Apr 19, 2013
設立日1997
過去5年間の配当金総支払額は
301.29M
米ドルである。
IMOS.NB Final Cash Dividend of gross USD 1.098163 paid on Jul 26, 2024 going ex on Jun 27, 2024
IMOS.NB Final Cash Dividend of gross USD 1.476772 paid on Jul 27, 2023 going ex on Jun 29, 2023
IMOS.NB Final Cash Dividend of gross USD 2.875965 paid on Jul 27, 2022 going ex on Jun 29, 2022
IMOS.NB Final Cash Dividend of gross USD 1.58188 paid on Sep 08, 2021 going ex on Aug 06, 2021
IMOS.NB Final Cash Dividend of gross USD 1.226742 paid on Aug 07, 2020 going ex on Jul 01, 2020