Aehr Test Systems当前公司基本面数据相对健康,增长潜力较大。当前估值合理,在半导体与设备行业排名53/105位。机构持股占比非常高,近一月多位分析师给出公司评级为买入。最高目标价71.33。中期看,股价处于上升通道。近一个月,市场表现较差,但公司基本面和技术面得分较高。目前股价在压力位和支撑位之间,可以做区间波段操作。
Aehr Test Systems评分
相关信息
行业排名
53 / 105
全市场排名
216 / 4569
所属行业
半导体与设备
压力支撑
由于公司未披露,未能获取相关数据
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本期评分
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过去24小时
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过冷
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中性
Aehr Test Systems亮点
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Aehr Test Systems, Inc. offers test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. Its products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in phones, tablets and other computing devices. FOX-CP system is a single-wafer compact test solution for logic, memory and photonic devices. FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeters that enables integrated circuit manufacturers to perform testing, burn-in and stabilization of full wafers on the FOX-P systems. It offers packaged part reliability/burn-in test solutions.
Aehr Test Systems, Inc. offers test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. Its products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in phones, tablets and other computing devices. FOX-CP system is a single-wafer compact test solution for logic, memory and photonic devices. FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeters that enables integrated circuit manufacturers to perform testing, burn-in and stabilization of full wafers on the FOX-P systems. It offers packaged part reliability/burn-in test solutions.