ACM Research Inc
ACMR
查看详细走势图
40.070USD
-1.115-2.71%
收盘 03/27, 16:00（美东）报价延迟15分钟
1.82B总市值
27.34市盈率 TTM
盘中分时
1分
30分
1小时
日k
周k
月k
日k
今天
-2.71%
5天
-7.99%
1月
-28.04%
6月
+6.09%
今年开始到现在
+1.57%
1年
+48.85%
查看详细走势图
TradingKey ACM Research Inc股票评分
单位: USD 更新时间: 2026-03-27操作建议
ACM Research Inc当前公司基本面数据相对非常健康，最新ESG披露属于行业领先水平。增长潜力很大。当前估值合理，在半导体与设备行业排名31/106位。机构持股占比非常高，近一月多位分析师给出公司评级为买入。最高目标价70.60。中期看，股价处于平稳状态。近一个月，市场表现非常差，但公司基本面和技术面得分较高。目前股价在压力位和支撑位之间，可以做区间波段操作。
ACM Research Inc评分
压力支撑
由于公司未披露，未能获取相关数据
多维评测
本期评分
上期评分
公司舆情
过去24小时
热度
过冷
过热
中性
ACM Research Inc亮点
亮点风险
ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
业绩高增长
公司营业收入稳步增长，连续3年增长61.61%
利润高增长
公司净利润处于行业前列，最新年度总收入901.31M美元
估值合理
公司最新PB估值1.80，处于3年历史合理位
机构减仓
最新机构持股45.00M股，环比减少0.26%
CI 精选加拿大股票基金持仓
明星投资者CI 精选加拿大股票基金持仓，最新持仓市值160.00
活跃度增加
近期活跃度增加，过去20天平均换手率0.14
分析师目标
根据
7
位分析师
买入
评级
70.600
目标均价
+53.75%
涨幅空间
数据免责声明：分析师评级与目标价由LSEG提供，仅供参考，不应当作投资建议
ACM Research Inc新闻
即将为您带来更多新闻，敬请期待。。。
财务指标
每股收益
由于公司未披露，未能获取相关数据
营业总收入
由于公司未披露，未能获取相关数据
ACM Research Inc简介
ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
公司代码ACMR
公司ACM Research Inc
CEOKim (David)
网址https://www.acmr.com/
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