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ChipMOS Technologies Inc
IMOS添加自选
50.770USD
-2.840-5.30%
收盘 05/15, 16:00（美东）报价延迟15分钟
1.78B总市值
67.30市盈率 TTM
查看详细走势图
盘中分时
1分
30分
1小时
日k
周k
月k
日k
今天
-5.30%
5天
-15.76%
1月
+3.25%
6月
+64.73%
今年开始到现在
+71.35%
1年
+164.29%
TradingKey ChipMOS Technologies Inc股票评分
单位: USD 更新时间: 2026-05-15操作建议
ChipMOS Technologies Inc当前公司基本面数据相对非常健康，最新ESG披露属于行业领先水平。增长潜力很大。当前估值合理，在半导体与设备行业排名77/106位。机构持股占比非常高，中期看，股价处于上升通道。近一个月，市场表现很强，技术面和基本面综合得分较高，很强的走势得到基本面和技术面的印证。目前股价在压力位和支撑位之间，可以做区间波段操作。
ChipMOS Technologies Inc评分
压力支撑
由于公司未披露，未能获取相关数据
多维评测
本期评分
上期评分
公司舆情
过去24小时
热度
过冷
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中性
ChipMOS Technologies Inc亮点
亮点风险
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
高分红
公司属于高分红公司，最新股息支付率61.46%
稳定分红
公司5年内连续分红，最新股息支付率61.46%
估值高估
公司最新PB估值2.32，处于3年历史高位
机构减仓
最新机构持股2.23M股，环比减少12.47%
詹姆斯·西蒙斯持仓
明星投资者詹姆斯·西蒙斯持仓，最新持仓市值1.13M
活跃度增加
近期活跃度增加，过去20天平均换手率2.80
分析师目标
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位分析师
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目标均价
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涨幅空间
数据免责声明：分析师评级与目标价由LSEG提供，仅供参考，不应当作投资建议
ChipMOS Technologies Inc新闻
即将为您带来更多新闻，敬请期待。。。
财务指标
每股收益
由于公司未披露，未能获取相关数据
营业总收入
由于公司未披露，未能获取相关数据
ChipMOS Technologies Inc简介
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
公司代码IMOS
公司ChipMOS Technologies Inc
CEO
网址https://www.chipmos.com/
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