Die Fundamentaldaten des Unternehmens sind relativ sehr gesund. Seine Bewertung wird als angemessen bewertet angesehen,und die institutionelle Anerkennung ist sehr hoch. In den letzten 30 Tagen haben mehrere Analysten die Aktie mit einer Halten bewertet. Trotz einer schwachen Aktienmarktperformance zeigt das Unternehmen starke Fundamentaldaten und technische Indikatoren. Der Aktienkurs bewegt sich seitwärts zwischen den Unterstützungs- und Widerstandsniveaus, was ihn für schwankungsorientiertes Trading geeignet macht.
Aktienbewertung
Zugehörige Informationen
Branchenrang
26 / 98
Gesamtwertung
120 / 4724
Branche
Halbleiter & Halbleiterausrüstung
Widerstand & Unterstützung
Keine Daten
Radar Chart
Aktueller Preis
Vorher
Analysten-Ziel
Basierend auf insgesamt
11
Analysten
Halten
Aktuelles Rating
26.254
Kursziel
+3.12%
Aufwärtspotenzial
Hinweis: Analystenbewertungen und Kursziele werden von LSEG ausschließlich zu Informationszwecken bereitgestellt und stellen keine Anlageberatung dar.
Unternehmens-Highlights
HöhepunkteRisiko
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.