Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
BörsenkürzelAMKR
Name des UnternehmensAmkor Technology Inc
IPO-datumMay 01, 1998
CEOEngel (Kevin K)
Anzahl der mitarbeiter28300
WertpapierartOrdinary Share
GeschäftsjahresendeMay 01
Addresse2045 East Innovation Circle
StadtTEMPE
BörseNASDAQ OMX - NASDAQ BASIC
LandUnited States of America
Postleitzahl85284
Telefon14808215000
Websitehttps://www.amkor.com/
BörsenkürzelAMKR
IPO-datumMay 01, 1998
CEOEngel (Kevin K)