ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
公司代碼IMOS
公司名稱ChipMOS Technologies Inc
上市日期Apr 19, 2013
CEO- -
員工數量- -
證券類型Depository Receipt
年結日Apr 19
公司地址No.1, Yanfa 1st Road, Hsinchu Science Park
城市BAOSHAN
上市交易所NASDAQ OMX - NASDAQ BASIC
國家Taiwan
郵編300
電話88635770055
網址https://www.chipmos.com/
公司代碼IMOS
上市日期Apr 19, 2013
CEO- -