ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
Alto Crescimento
A receita da empresa tem crescido de forma consistente nos últimos 3 anos, com média de 61.61% ano a ano.
Alto Crescimento de Lucro
O lucro líquido da empresa lidera o setor, com o lucro anual mais recente totalizando US$ 901.31M.
Sobreavaliada
O PB mais recente da empresa é 4.09, em uma faixa percentil alta de 3 anos.
Venda Institucional
As participações institucionais mais recentes são de 51.21M ações, uma redução de 9.61% em relação ao trimestre anterior.
Mantido por Mason Hawkins
O Super Investidor Mason Hawkins possui 347.59K ações desta empresa.