ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
Código da empresaACMR
Nome da EmpresaACM Research Inc
Data de listagemNov 03, 2017
Fundado em2016
CEOMr. Jian Wang
Número de funcionários2023
Tipo de títulosOrdinary Share
Fim do ano fiscalNov 03
Endereço42307 Osgood Rd Ste I
CidadeFREMONT
Bolsa de valoresNASDAQ Global Market Consolidated
PaísUnited States of America
Código postal94539-5062
Telefone15104453700
Sitehttps://www.acmrcsh.com/
Código da empresaACMR
Data de listagemNov 03, 2017
Fundado em2016
Um total de
0.00
USD foi distribuído em dividendos nos últimos 5 anos.

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