ChipMOS Technologies Inc
IMOS
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18.390USD
+0.670+3.78%
Handelsschluss 09/15, 16:00（ET）Kurse um 15 Minuten verzögert
652.41MMarktkapitalisierung
143.33KGV TTM
Intraday
1m
30m
1h
D
W
M
D
Heute
+3.78%
5 Tage
+5.09%
1 Monat
+12.13%
6 Monate
+0.38%
Seit Jahresbeginn
-2.34%
1 Jahr
-19.34%
Detailliertes Diagramm anzeigen
TradingKey Aktien-Score
Währung: USD Aktualisiert：2025-09-12Wichtige Einblicke
Die Fundamentaldaten des Unternehmens sind relativ sehr gesund. Seine Bewertung wird als unterbewertet angesehen,und die institutionelle Anerkennung ist sehr hoch. Das Unternehmen schneidet an der Börse gut ab, mit starken Fundamentaldaten und technischen Aspekten, die den aktuellen Trend unterstützen. Der Aktienkurs bewegt sich seitwärts zwischen den Unterstützungs- und Widerstandsniveaus, was ihn für schwankungsorientiertes Trading geeignet macht.
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Unternehmens-Highlights
HöhepunkteRisiko
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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high_dividend_desc%!(EXTRA string=61.46%)
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stable_dividend_desc%!(EXTRA string=61.46%)
valuation_underestimated
valuation_underestimated_desc%!(EXTRA string=PB, string=0.85)
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institutional_decreasing_position_desc%!(EXTRA string=2.34M, string=13.54%)
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institutional_hold_desc%!(EXTRA string=James Simons, string=1.15M)
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Unternehmen
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
BörsenkürzelIMOS
UnternehmenChipMOS Technologies Inc
CEO
Websitehttps://www.chipmos.com/
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