GPU-HBM Packaging Welcomes New Fiber Interconnection Solution. "Optical-In Copper-Out" Accelerates, Optical Communication Sector Leads Gains in Early Trading.
Tradingkey - In early US trading on May 26, optical communication stocks led the gains. As of press time, Amphenol (APH) rose 7.04%, Viavi Solutions (VIAV) rose 6.32%, Marvell Technology (MRVL) rose 5.67%, Broadcom (AVGO) rose 5.05%, Nokia (NOK) rose 4.43%, and Corning (GLW) rose 2.63%. According to media reports, a core researcher from a leading South Korean memory manufacturer revealed that global memory and advanced packaging companies are jointly exploring a breakthrough GPU-HBM heterogeneous integration solution. This approach aims to break the physical constraints of traditional 2.5D packaging, where HBM must be positioned adjacent to the GPU, by packaging computing and memory units independently and interconnecting them via high-speed optical fiber links.