ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Símbolo de cotizaciónIMOS
Nombre de la empresaChipMOS Technologies Inc
Fecha de salida a bolsaApr 19, 2013
Director ejecutivo- -
Número de empleados- -
Tipo de seguridadDepository Receipt
Fin del año fiscalApr 19
DirecciónNo.1, Yanfa 1st Road, Hsinchu Science Park
CiudadBAOSHAN
Bolsa de valoresNASDAQ OMX - NASDAQ BASIC
PaísTaiwan
Código postal300
Teléfono88635770055
Sitio Webhttps://www.chipmos.com/
Símbolo de cotizaciónIMOS
Fecha de salida a bolsaApr 19, 2013
Director ejecutivo- -