ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
Alto crecimiento
Los ingresos de la empresa han crecido de manera constante durante los últimos tres años, con un promedio interanual del 61.61%.
Alto crecimiento de los beneficios
Los ingresos netos de la empresa lideran el sector. Sus ingresos anuales más recientes ascienden a 901.31M USD.
Sobrevalorada
El PB más reciente de la empresa es 4.09, en un rango percentil alto de 3 años.
Venta institucional
Las tenencias institucionales más recientes son 51.21M acciones, lo que supone una reducción del 9.61% con respecto al trimestre anterior.
En posesión de Mason Hawkins
El inversor estrella Mason Hawkins posee 347.59K acciones de este valor.