ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
Símbolo de cotizaciónACMR
Nombre de la empresaACM Research Inc
Fecha de salida a bolsaNov 03, 2017
Fundada en2016
Director ejecutivoMr. Jian Wang
Número de empleados2023
Tipo de seguridadOrdinary Share
Fin del año fiscalNov 03
Dirección42307 Osgood Rd Ste I
CiudadFREMONT
Bolsa de valoresNASDAQ Global Market Consolidated
PaísUnited States of America
Código postal94539-5062
Teléfono15104453700
Sitio Webhttps://www.acmrcsh.com/
Símbolo de cotizaciónACMR
Fecha de salida a bolsaNov 03, 2017
Fundada en2016
Un total de
0.00
USD se ha distribuido en dividendos durante los últimos 5 años.

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