TradingKey - The latest monthly revenue data released by TSMC (TSM) once again shows that demand for AI chips continues to drive growth in the global foundry market. On September 10, TSMC reported its August 2026 revenue, with monthly consolidated revenue reaching NT$514.86 billion, representing a year-on-year increase of 53.3% and a month-on-month increase of 10.1%, setting a new record high for the fourth consecutive month.

TradingKeyThu, Sep 10

OpenAI Deepens Next-Generation AI Chip Cooperation With Samsung, Anthropic Also Seeks Foundry Support

TradingKey - According to Reuters, OpenAI recently stated that it is deepening its semiconductor partnership with Samsung Electronics, with both parties engaging in joint production and R&D for the next-generation chips currently being developed by OpenAI, further expanding their scope of cooperatio

TradingKeyWed, Sep 9

SK Hynix Reportedly Considers Intel HBM4E Base Chips, Seeking to Reduce Reliance on TSMC

TradingKey - According to the latest reports from South Korean media, SK Hynix (SKHY) is considering collaborating with Intel's (INTC) foundry business to outsource part of the production of its next-generation HBM4E base dies to Intel to expand its supply sources. The proposal remains under evaluat

TradingKeyMon, Aug 31

TSMC Stock Price Prediction: As AI Chip Demand Heats Up, Can TSM Hit New Highs in 2026?

TradingKey - Unlike fabless chip design companies such as Nvidia and AMD, TSMC does not rely on the success or failure of any single GPU or AI accelerator; instead, it manufactures chips using advanced process technologies for a diverse range of clients. Therefore, as long as global investment in AI computing power continues to grow, TSMC is well-positioned to secure sustained orders from the expanding demand for chips.

TradingKeySat, Aug 29

Report Says TSMC Ready to Mass Produce 1.6nm A16 Chips in Q4, but Is It Ahead of Intel and Samsung?

TradingKey - According to the latest supply chain reports, TSMC (TSM) has completed the development and verification of its 1.6nm-class A16 process, targeting the launch of mass production in the fourth quarter of 2026. This timeline is largely consistent with TSMC's previous official statement that "A16 will enter mass production in the second half of 2026," signaling that following 2nm, the company's next-generation advanced process technology is accelerating toward commercialization.

TradingKeyThu, Aug 20

TSMC CoWoS Yield Tops 98% for Some Lines, Targets 14x Reticle Size by 2029

TradingKey - On August 11, TSMC disclosed at the OCP APAC Summit that its 5.5x reticle size CoWoS advanced packaging solution has entered mass production. The solution can accommodate up to 12 HBM4 stacks and has been validated across products from multiple AI customers, with yield rates for certain AI chips consistently exceeding 98% and select cases even reaching 99%.

TradingKeyThu, Aug 13

Bernstein Raises TSMC Target Price by Nearly 19%, Sees CPUs Replacing GPUs as Main Growth Driver

TradingKey - On August 11 Asia-Pacific time, Wall Street investment bank Bernstein released a research report raising TSMC's price target from NT$2,780 to NT$3,300 (equivalent to $102.4), citing that central processing units are expected to become the next growth driver for the global foundry leader.

TradingKeyTue, Aug 11

TSMC July Revenue Rises 44.7% to Record High as AI Chip Demand Remains Strong

TradingKey - TSMC’s July consolidated revenue totaled NT$467.58 billion (approximately $14.5 billion), representing a year-on-year increase of 44.7% and a 5.6% increase from June. Cumulative revenue for the first seven months of the year reached NT$2.87 trillion. July revenue not only sustained a high growth rate but also set a new monthly record, indicating that orders for advanced nodes and high-performance computing (HPC) remain at elevated levels.

TradingKeyMon, Aug 10

TSMC Partners With Sony on $6.3 Billion Kumamoto Plant for Physical AI Sensors

TradingKey - According to a Nikkei report on August 10, Sony Group (SONY) and TSMC (TSM) plan to invest in an image sensor joint venture project in Kumamoto Prefecture, Japan. The total investment is approximately 1 trillion yen (about $6.3 billion), with mass production of next-generation sensors expected to begin as early as 2029.

TradingKeyMon, Aug 10

DRAM Shortage Impacts Apple Chip Supply; $1 Billion in TSMC Processor Orders Cannot Be Packaged

TradingKey - Due to persistent global DRAM memory supply constraints, market reports indicate that TSMC (TSM) is facing packaging delays for Apple processor orders valued at approximately $1 billion. The primary cause is a shortage of supporting memory supply, which has prevented some chips from completing final packaging as originally scheduled. This news once again underscores how the supply-demand imbalance in memory chips driven by the AI wave is spreading across the entire semiconductor supply chain.

TradingKeyThu, Aug 6

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