Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Alto dividendo
La empresa es una gran pagadora de dividendos. Su ratio de pago de dividendos más reciente es del 50.48%.
Dividendo estable
La empresa ha pagado dividendos de forma regular durante los últimos 5 años. Su ratio de pago de dividendos más reciente es del 50.48%.
Sobrevalorada
El PB más reciente de la empresa es 4.50, en un rango percentil alto de 3 años.
Venta institucional
Las tenencias institucionales más recientes son 117.29M acciones, lo que supone una reducción del 4.76% con respecto al trimestre anterior.
En posesión de Ray Dalio
El inversor estrella Ray Dalio posee 986.15K acciones de este valor.
Mayor actividad del mercado
La empresa está generando mayor interés entre los inversores, con una relación de rotación de 20 días del 1.26.