No ano passado, ChipMOS Technologies Inc gerou US$ 219.08M em seu segmento de melhor desempenho, Packaging. A região Taiwan teve a maior contribuição, com US$ 666.94M no período.

Por Empresa

Receita

Proporção

Anual

Anual

Trimestral

Packaging

Flat Panel Display Driver IC

Testing

Wafer Bump

FY2025

FY2024

FY2023

FY2022

FY2021

FY2020

FY2019

Packaging

219.08M(28.53%)

167.98M(23.75%)

148.66M(21.68%)

225.23M(28.52%)

285.20M(29.06%)

203.83M(26.08%)

166.72M(25.32%)

Flat Panel Display Driver IC

188.35M(24.53%)

228.07M(32.25%)

251.17M(36.62%)

244.80M(30.99%)

294.06M(29.97%)

238.51M(30.52%)

224.14M(34.04%)

Testing

182.19M(23.72%)

154.81M(21.89%)

141.12M(20.58%)

176.13M(22.30%)

211.28M(21.53%)

169.90M(21.74%)

137.87M(20.94%)

Wafer Bump

178.34M(23.22%)

156.39M(22.11%)

144.84M(21.12%)

143.70M(18.19%)

190.72M(19.44%)

169.25M(21.66%)

129.81M(19.71%)

Por Região

Receita

Proporção

Anual

Anual

Trimestral

Taiwan

China

Japan

Other Foreign

Singapore

FY2025

FY2024

FY2023

FY2022

FY2021

FY2020

FY2019

Taiwan

666.94M(86.85%)

563.39M(79.66%)

555.14M(80.95%)

627.09M(79.39%)

773.86M(78.86%)

622.90M(79.71%)

514.04M(78.06%)

China

45.90M(5.98%)

52.46M(7.42%)

55.55M(8.10%)

66.20M(8.38%)

68.02M(6.93%)

37.54M(4.80%)

25.56M(3.88%)

Japan

39.37M(5.13%)

42.14M(5.96%)

37.77M(5.51%)

66.83M(8.46%)

63.33M(6.45%)

43.84M(5.61%)

61.69M(9.37%)

Other Foreign

15.74M(2.05%)

18.69M(2.64%)

15.62M(2.28%)

16.61M(2.10%)

17.65M(1.80%)

14.76M(1.89%)

14.09M(2.14%)

Singapore

--(--)

30.58M(4.32%)

21.71M(3.17%)

13.12M(1.66%)

58.40M(5.95%)

62.43M(7.99%)

43.17M(6.55%)