By Wen-Yee Lee
TAIPEI, Aug 12 (Reuters) - Taiwan Semiconductor Manufacturing Co (TSMC) 2330.TW will gradually exit its 6-inch wafer manufacturing business over the next two years and continue consolidating its 8-inch wafer production capacity to improve efficiency, the company said on Tuesday.
The decision, which TSMC told Reuters in a statement was made after a thorough evaluation, was based on market conditions and aligned with the company’s long-term business strategy.