tradingkey.logo

STMicroelectronics Details Restructuring Program

ReutersApr 10, 2025 12:06 PM

- STMicroelectronics NV STMPA.PA:

  • DETAILS COMPANY-WIDE PROGRAM TO RESHAPE MANUFACTURING FOOTPRINT AND RESIZE GLOBAL COST BASE

  • PLANNED INVESTMENTS IN ADVANCED MANUFACTURING INFRASTRUCTURE THROUGH 2027

  • TARGETS HIGH TRIPLE-DIGIT MILLION-DOLLAR COST SAVINGS BY 2027

  • PLANNED INVESTMENTS OVER FY2025, 2026 AND 2027 TO FOCUS ON ADVANCED MANUFACTURING INFRASTRUCTURE IN 300MM SILICON, 200MM SILICON CARBIDE, AND TECHNOLOGY RESEARCH AND DEVELOPMENT

  • CONFIRMATION OF ANNUAL COST SAVINGS TARGET IN THE HIGH TRIPLE-DIGIT MILLION-DOLLAR RANGE EXITING 2027.

  • AGRATE 300MM FAB TO BECOME FLAGSHIP HIGH-VOLUME MANUFACTURING FACILITY

  • UP TO 2,800 EMPLOYEES TO LEAVE STMICROELECTRONICS GLOBALLY OVER 3 YEARS

  • CROLLES 300MM FAB TO BE CORE OF DIGITAL PRODUCTS ECOSYSTEM

  • TOURS TO REMAIN FOCUSED ON 200MM SILICON PRODUCTION

  • FRANCE'S ROUSSET, AND SINGAPORE'S ANG MO KIO TO REMAIN FOCUSED ON 200MM MANUFACTURING

Disclaimer: The information provided on this website is for educational and informational purposes only and should not be considered financial or investment advice.

Related Articles

KeyAI