
April 10 (Reuters) - STMicroelectronics NV STMPA.PA:
DETAILS COMPANY-WIDE PROGRAM TO RESHAPE MANUFACTURING FOOTPRINT AND RESIZE GLOBAL COST BASE
PLANNED INVESTMENTS IN ADVANCED MANUFACTURING INFRASTRUCTURE THROUGH 2027
TARGETS HIGH TRIPLE-DIGIT MILLION-DOLLAR COST SAVINGS BY 2027
PLANNED INVESTMENTS OVER FY2025, 2026 AND 2027 TO FOCUS ON ADVANCED MANUFACTURING INFRASTRUCTURE IN 300MM SILICON, 200MM SILICON CARBIDE, AND TECHNOLOGY RESEARCH AND DEVELOPMENT
CONFIRMATION OF ANNUAL COST SAVINGS TARGET IN THE HIGH TRIPLE-DIGIT MILLION-DOLLAR RANGE EXITING 2027.
AGRATE 300MM FAB TO BECOME FLAGSHIP HIGH-VOLUME MANUFACTURING FACILITY
UP TO 2,800 EMPLOYEES TO LEAVE STMICROELECTRONICS GLOBALLY OVER 3 YEARS
CROLLES 300MM FAB TO BE CORE OF DIGITAL PRODUCTS ECOSYSTEM
TOURS TO REMAIN FOCUSED ON 200MM SILICON PRODUCTION
FRANCE'S ROUSSET, AND SINGAPORE'S ANG MO KIO TO REMAIN FOCUSED ON 200MM MANUFACTURING