Kulicke and Soffa Industries Inc의 펀더멘털은 비교적 안정적 상태이며, ESG 공시는 업계를 선도하는 수준입니다.성장 잠재력은 높습니다.기업의 밸류에이션은 적정하게 평가된 것으로 간주되며, 반도체 및 반도체 장비 산업에서 104개 중 11위 랭킹.기관 보유 비율은 매우 높은.지난 한 달 동안 여러 애널리스트가 해당 기업을 매수(으)로 평가했으며, 최고 목표 가격은 64.00입니다.중기적으로 주가는 상승 추세일 것으로 예상됩니다.기업은 지난 한 달간 주식 시장에서 탁월한 성과를 기록했으며, 탄탄한 펀더멘털과 기술적 지표가 이를 뒷받침하고 있습니다.주가는 지지선과 저항선 사이에서 횡보하고 있으며, 범위 매매 기반의 스윙 트레이딩에 적합한 상황입니다.
Kulicke and Soffa Industries Inc 점수
관련 정보
산업 순위
11 / 104
전체 순위
83 / 4521
산업
반도체 및 반도체 장비
저항선 & 지지선
기업이 아직 관련 데이터를 공개하지 않았습니다.
레이더 차트
현재 가격
과거
미디어 보도
최근 24 시간
보도 수준
매우 낮은
매우 높은
중립
Kulicke and Soffa Industries Inc 주요 내용
강점위험 요소
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and selling ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment are in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and selling ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment are in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.