회사의 펀더멘털은 비교적 아주 건전한한 편입니다. 회사의 밸류에이션은 과소 평가된으로 간주됩니다. 기관의 인지도는 매우 높은입니다. 지난 30일 동안 여러 애널리스트들이 이 회사를 매수로 평가했습니다. 주식시장에서 부진한 성과에도 불구하고, 회사는 강한 펀더멘털과 기술적 지표를 보이고 있습니다. 주가는 지지선과 저항선 사이에서 횡보하고 있으며, 범위 매매 기반의 스윙 트레이딩에 적합한 상황입니다.
주식 점수
관련 정보
산업 순위
48 / 98
전체 순위
170 / 4714
산업
반도체 및 반도체 장비
저항선 & 지지선
데이터 없음
레이더 차트
현재 가격
과거
분석가 목표가
6
명의 분석가를 기준으로
매수
현재 등급
43.167
목표 가격
+5.16%
상승 여력
면책 조항: 애널리스트 평가 및 목표 주가는 정보 제공을 위한 목적으로 LSEG에서 제공되며, 투자 조언으로 간주되지 않습니다.
기업 하이라이트
강점위험 요소
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provide services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.
손실 전환
회사의 실적이 적자로 전환되어, 최근 연간 손실은 미화 69.01M달러에 달합니다%!(EXTRA int=2)
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provide services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.