ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
회사 코드IMOS
회사 이름ChipMOS Technologies Inc
상장일Apr 19, 2013
설립일1997
CEO- -
직원 수- -
유형Ordinary Share
회계 연도 종료Apr 19
주소No.1, Yanfa 1st Road, Hsinchu Science Park
도시BAOSHAN
증권 거래소Iraq Stock Exchange
국가Taiwan
우편 번호300
전화88635770055
웹사이트https://www.chipmos.com/
회사 코드IMOS
상장일Apr 19, 2013
설립일1997
지난 5년 동안 총
301.29M
USD의 배당금이 분배되었습니다.
IMOS.NB Final Cash Dividend of gross USD 1.098163 paid on Jul 26, 2024 going ex on Jun 27, 2024
IMOS.NB Final Cash Dividend of gross USD 1.476772 paid on Jul 27, 2023 going ex on Jun 29, 2023
IMOS.NB Final Cash Dividend of gross USD 2.875965 paid on Jul 27, 2022 going ex on Jun 29, 2022
IMOS.NB Final Cash Dividend of gross USD 1.58188 paid on Sep 08, 2021 going ex on Aug 06, 2021
IMOS.NB Final Cash Dividend of gross USD 1.226742 paid on Aug 07, 2020 going ex on Jul 01, 2020