ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
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๋ชฉ ์ฝ๋ ACMR
ํ์ฌ ์ด๋ฆACM Research Inc
์์ฅ์ผNov 03, 2017
CEOKim (David)
์ง์ ์2023
์ ํOrdinary Share
ํ๊ณ ์ฐ๋ ์ข
๋ฃNov 03
์ฃผ์42307 Osgood Rd, Unit I
๋์FREMONT
์ฆ๊ถ ๊ฑฐ๋์NASDAQ OMX - NASDAQ BASIC
๊ตญ๊ฐUnited States of America
์ฐํธ ๋ฒํธ94539
์ ํ15104453700
์น์ฌ์ดํธhttps://www.acmr.com/
์ข
๋ชฉ ์ฝ๋ ACMR
์์ฅ์ผNov 03, 2017
CEOKim (David)
์ง๋ 5๋
๋์ ์ด
0.00
USD์ ๋ฐฐ๋น๊ธ์ด ๋ถ๋ฐฐ๋์์ต๋๋ค.

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