ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
회사 코드ACMR
회사 이름ACM Research Inc
상장일Nov 03, 2017
설립일2016
CEOMr. Jian Wang
직원 수2023
유형Ordinary Share
회계 연도 종료Nov 03
주소42307 Osgood Rd Ste I
도시FREMONT
증권 거래소NASDAQ Global Market Consolidated
국가United States of America
우편 번호94539-5062
전화15104453700
웹사이트https://www.acmrcsh.com/
회사 코드ACMR
상장일Nov 03, 2017
설립일2016
지난 5년 동안 총
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