ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
BörsenkürzelACMR
Name des UnternehmensACM Research Inc
IPO-datumNov 03, 2017
Gegründet am2016
CEOMr. Jian Wang
Anzahl der mitarbeiter2023
WertpapierartOrdinary Share
GeschäftsjahresendeNov 03
Addresse42307 Osgood Rd Ste I
StadtFREMONT
BörseNASDAQ Global Market Consolidated
LandUnited States of America
Postleitzahl94539-5062
Telefon15104453700
Websitehttps://www.acmrcsh.com/
BörsenkürzelACMR
IPO-datumNov 03, 2017
Gegründet am2016
In den vergangenen 5 Jahren wurden insgesamt
0.00
USD an Dividenden ausgeschüttet.

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