Winbond seeks $750 million in bond sale to fund capacity expansion
SINGAPORE/SYDNEY, March 24 (Reuters) - Taiwan memory chip maker Winbond Electronics 2344.TW launched a $750 million convertible bond sale on Tuesday, according to a term sheet seen by Reuters.
Winbond supplies semiconductor memory products, including DRAM and code-storage flash memory, to customers in the communications, consumer electronics, automotive, industrial, and computer peripheral markets, according to its official website.
The bonds will mature in about one year. They will pay no coupon.
The conversion premium was set at 7.5% to 10.0% over Winbond's Tuesday closing share price of T$99.50 ($3.11), the term sheet showed.
Citi C.N is the sole global coordinator and a joint bookrunner on the deal.
Winbond plans to use the proceeds to buy machinery and equipment in foreign currencies as it expands production capacity and upgrades processes, the term sheet said.
Books opened on Tuesday. The deal is expected to price on or about March 24 and close on or about March 31.
($1 = 31.9680 Taiwan dollars)
