Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
High Dividend
The company is a high dividend payer, with the latest dividend payout ratio of 50.48%.
Stable Dividend
The company has regularly paid dividends over the past 5 years, with the latest dividend payout ratio of 50.48%.
Overvalued
The company’s latest PB is 4.50, at a high 3-year percentile range.
Institutional Selling
The latest institutional holdings are 117.29M shares, decreasing 4.76% quarter-over-quarter.
Held by Ray Dalio
Star Investor Ray Dalio holds 986.15K shares of this stock.
Higher Market Activity
The company has more investor interest, with a 20-day turnover ratio of 1.26.