Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
高配当
同社は高配当銘柄であり、最新の配当性向は50.48%です。
安定配当
同社は過去5年間にわたり継続的に配当を実施しており、最新の配当性向は50.48%です。
割高
同社の最新のPBは3.32で、過去3年間の水準と比較して高値圏にあります。
機関投資家の売り越し
最新の機関投資家の保有株数は117.29M株で、前四半期比で4.76%減少しています。
レイ・ダリオが保有
スター投資家レイ・ダリオは本銘柄を986.15K株保有しています。
市場活動が低調
同社への投資家の関心は低下しており、20日間の売買回転率は0.63です。