Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
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äŒç€ŸåAmkor Technology Inc
äžå Žæ¥May 01, 1998
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ãCEOãEngel (Kevin K)
åŸæ¥å¡æ°28300
蚌åžçš®é¡Ordinary Share
æ±ºç®ææ«May 01
æ¬ç€Ÿæåšå°2045 East Innovation Circle
éœåžTEMPE
蚌åžååŒæNASDAQ OMX - NASDAQ BASIC
åœUnited States of America
éµäŸ¿çªå·85284
é»è©±çªå·14808215000
ãŠã§ããµã€ãhttps://www.amkor.com/
äŒæ¥ã³ãŒãAMKR
äžå Žæ¥May 01, 1998
æé«çµå¶è²¬ä»»è
ãCEOãEngel (Kevin K)