SK Hynix says readying HBM4 production after completing internal certification

SEOUL, Sept 12 (Reuters) - South Korea's SK Hynix 000660.KS said on Friday it has completed its internal certification process for next generation high-bandwidth memory 4(HBM4) chips and established a production system for customers.

In March, the South Korean chipmaker, a key supplier to AI giant Nvidia NVDA.O, said it had shipped its HBM4 12-layer chip samples to customers, adding that the company aims to complete preparations for mass production of 12-layer HBM4 products within the second half of this year.

HBM - a type of dynamic random access memory or DRAM standard first produced in 2013 - involves stacking chips vertically to save space and reduce power consumption, helping to process the large volumes of data generated by complex AI applications.