Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
종목 코드 AMKR
회사 이름Amkor Technology Inc
상장일May 01, 1998
CEOEngel (Kevin K)
직원 수28300
유형Ordinary Share
회계 연도 종료May 01
주소2045 East Innovation Circle
도시TEMPE
증권 거래소NASDAQ OMX - NASDAQ BASIC
국가United States of America
우편 번호85284
전화14808215000
웹사이트https://www.amkor.com/
종목 코드 AMKR
상장일May 01, 1998
CEOEngel (Kevin K)