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Aehr Test Systems

AEHR

詳现チャヌトを衚瀺

30.190USD

-0.690-2.23%
終倀 09/26, 16:00ET15分遅れの株䟡
901.99M時䟡総額
損倱額盎近12ヶ月PER

Intraday
1m
30m
1h
D
W
M
D

本日

-2.23%

5日間

+0.80%

1ヶ月

+16.61%

6ヶ月

+239.60%

幎初来

+81.54%

1幎間

+129.93%

詳现チャヌトを衚瀺

TradingKey 株匏スコア

通貚: USD 曎新時刻: 2025-09-26

䞻芁むンサむト

同瀟の財務状況は比范的健党です。同瀟の株䟡は適正䟡栌ず評䟡されおいたす。たた、機関投資家による認知床は非垞に高いです。過去30日間で、耇数のアナリストが同瀟をホヌルドず評䟡したした。垂堎でのパフォヌマンスは非垞に䜎調ですが、ファンダメンタルズずテクニカルは堅調です。株䟡は支持線ず抵抗線の間で暪ばい掚移しおおり、レンゞ盞堎でのスむングトレヌドに適しおいたす。

株匏スコア

関連情報

業界内順䜍
52 / 98
党䜓ランキング
176 / 4714
業皮
半導䜓 & 半導䜓補造装眮

支持線ず抵抗線

デヌタなし

レヌダヌチャヌト

珟圚
前回倀

アナリスト目暙株䟡

3 人のアナリスト予想に基づく
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珟圚の評䟡
16.500
目暙株䟡
-46.57%
䞊昇䜙地
免責事項アナリストのレヌティングおよび目暙株䟡は、情報提䟛のみを目的ずしおLSEG Data & Analyticsが提䟛するものであり、投資助蚀を構成するものではありたせん。

䌁業ハむラむト

匷みリスク
Aehr Test Systems, Inc. offers test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. Its products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in phones, tablets and other computing devices. FOX-CP system is a single-wafer compact test solution for logic, memory and photonic devices. FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeters that enables integrated circuit manufacturers to perform testing, burn-in and stabilization of full wafers on the FOX-P systems. It offers packaged part reliability/burn-in test solutions.
成長䞭
同瀟は成長フェヌズにあり、最新の幎間収益はUSD 58.97Mに達しおいたす。
赀字転萜
同瀟の業瞟は赀字に転じ、最新の幎間損倱はUSD 3.91Mです。%!(EXTRA int=2)
適正氎準
同瀟の最新のPBは7.34で、過去3幎間の氎準ず比范しお適正圏にありたす。
機関投資家の売り越し
最新の機関投資家の保有株数は21.81M株で、前四半期比で35.39%枛少しおいたす。
バンガヌドが保有
スタヌ投資家バンガヌドは本銘柄を2.22M株保有しおいたす。

ニュヌス

最新情報をお埅ちください...

財務指暙

EPS

デヌタなし

総売䞊高

デヌタなし

䌁業名

Aehr Test Systems, Inc. offers test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. Its products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in phones, tablets and other computing devices. FOX-CP system is a single-wafer compact test solution for logic, memory and photonic devices. FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeters that enables integrated circuit manufacturers to perform testing, burn-in and stabilization of full wafers on the FOX-P systems. It offers packaged part reliability/burn-in test solutions.
䌁業コヌドAEHR
䌁業名Aehr Test Systems
最高経営責任者「CEO」Mr. Gayn Erickson
りェブサむトhttps://www.aehr.com/
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