Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
公司代碼AMKR
公司名稱Amkor Technology Inc
上市日期May 01, 1998
CEOEngel (Kevin K)
員工數量28300
證券類型Ordinary Share
年結日May 01
公司地址2045 East Innovation Circle
城市TEMPE
上市交易所NASDAQ OMX - NASDAQ BASIC
國家United States of America
郵編85284
電話14808215000
網址https://www.amkor.com/
公司代碼AMKR
上市日期May 01, 1998
CEOEngel (Kevin K)