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Amkor Technology Inc

AMKR
查看詳細走勢圖
49.360USD
+5.090+11.50%
收盤 02/06, 16:00美東報價延遲15分鐘
12.20B總市值
39.59本益比TTM

Amkor Technology Inc

49.360
+5.090+11.50%
盤中分時
1分
30分
1小時
日k
週k
月k
日k

今天

+11.50%

5天

+2.13%

1月

-3.76%

6月

+122.24%

今年開始到現在

+25.03%

1年

+100.65%

查看詳細走勢圖

TradingKey Amkor Technology Inc股票評分

單位: USD 更新時間: 2026-02-06

操作建議

Amkor Technology Inc當前公司基本面數據相對健康,最新ESG揭露屬於行業領先水平。增長潛力很大。當前估值合理,在半導體與設備行業排名53/104位。機構持股佔比非常高,近一月多位分析師給出公司評級為持有。最高目標價為42.55。中期看,股價處於上升通道。近一個月,市場表現較差,但公司基本面和技術面得分較高。目前股價在壓力位和支撐位之間,可以做區間波段操作。

Amkor Technology Inc評分

相關信息

行業排名
53 / 104
全市場排名
181 / 4521
所屬行業
半導體與設備

壓力支撐

由於公司未披露,未能獲取相關數據

多維評測

本期評分
上期評分

公司輿情

過去24小時
熱度

過冷
過熱
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Amkor Technology Inc亮點

亮點風險
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
高分紅
公司屬於高分紅公司,最新股息支付率50.48%
穩定分紅
公司5年內持續分紅,最新股息支付率50.48%
估值高估
公司最新PB估值2.83,處於3年歷史高位
機構加倉
最新機構持股111.31M股,環比增加0.10%
CI 精選加拿大股票基金持倉
明星投資者CI 精選加拿大股票基金持倉,最新持倉2.64K股

分析師目標

基於 12 分析師
持有
評級
42.555
目標均價
-3.87%
漲幅空間
數據免責聲明:分析師評級與目標價由LSEG提供,僅供參考,不應當作投資建議

Amkor Technology Inc新聞

即將為您帶來更多新聞,敬請期待。 。 。

財務指標

每股收益

由於公司未披露,未能獲取相關數據

營業總收入

由於公司未披露,未能獲取相關數據

Amkor Technology Inc簡介

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
公司代碼AMKR
公司Amkor Technology Inc
CEOEngel (Kevin K)
網址https://www.amkor.com/
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