Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
높은 배당금
회사는 높은 배당금을 지급하는 회사로, 최신 배당금 지급 비율은 50.48%입니다.
안정적인 배당금
회사는 지난 5년 동안 정기적으로 배당금을 지급하였으며, 최신 배당금 지급 비율은 50.48%입니다.
공정한 가치
회사의 최신 PB은 1.71로, 최근 3년 기준 중간 백분위 범위에 속합니다.
기관 매도
최신 기관 보유 주식 수는 245.28M주이며, 전 분기 대비 9.64% 감소했습니다.
더 뱅가드가 보유
스타 투자자 더 뱅가드이(가) 이 주식 15.03M주를 보유하고 있습니다.