Citi Hikes TSMC Price Target by Over 30%. Some Key Information You Need to Know Ahead of Earnings Call.

Citi expects TSMC to raise its full-year revenue guidance at its July 16 earnings conference, citing that AI demand is no longer concentrated solely on Nvidia GPUs, as customized ASICs, TPUs, networking chips, and CPUs are all consuming advanced node capacity. TSMC's customer structure is shifting from relying on a single client to having multiple clients simultaneously driving growth, thereby increasing revenue certainty.

Citi believes that no matter how fierce foundry competition becomes, TSMC's scale advantage will continue to support its pricing and gross margin. It is expected that by the end of 2028, TSMC's monthly capacity for advanced nodes will reach 350,000 to 400,000 wafers, with economies of scale further widening the gap with competitors.

Whether tech giants develop their own proprietary chips or Nvidia continues to dominate the AI accelerator market, both ultimately rely on TSMC's advanced nodes for mass production. TSMC's role is essentially the infrastructure of the AI era. In addition, Goldman Sachs ( GS) and UBS, among other institutions, have also raised their target prices:

TSMC's Q2 revenue guidance is $39 billion to $40.2 billion, with market consensus near the upper end of $40.2 billion, representing a quarter-on-quarter increase of about 10% and a year-on-year increase of 32%. Cumulative revenue from January to May this year grew 30% year-on-year, making Q2 results essentially a foregone conclusion. The market is more optimistic about Q3, generally expecting USD revenue to increase by 10% to 15% quarter-on-quarter, driven primarily by 3nm and 4nm production lines running at full capacity.

Q1 gross margin reached 66.2%, beating market expectations of 64.5%. Q2 guidance remains in a high range of 65.5% to 67.5%, with the operating margin expected to be between 56.5% and 58.5%.

Institutions such as ALETHEIA predict that the Q2 gross margin could challenge 69%, which, if realized, would set a historical record. Supporting this projection are rising capacity utilization, product mix optimization, and relatively favorable exchange rate trends.

TSMC expects its 2026 capital expenditure to be $52 billion to $56 billion. Citi raised its capital expenditure forecasts for 2027 and 2028 to $75 billion to $80 billion, indicating that TSMC is accelerating capacity expansion for long-term AI demand. Goldman Sachs also raised its 2027 capital expenditure forecast to $78 billion, aligning with Citi's assessment.

Will AI demand guidance be revised upward again?

This is the most crucial topic of this investor conference. At its January 2026 earnings call, TSMC had already revised its full-year USD revenue growth guidance upward from 30% to "more than 30%," but actual demand for AI continues to exceed expectations. TSMC Chairman C.C. Wei said at the time that "AI demand is real" and revealed that he had personally communicated with customers and his customers' customers, confirming that this growth wave is genuine.

Three key points to watch: whether the full-year growth guidance is revised upward again; whether management confirms that AI demand is spreading from GPUs to peripheral chips; and management's stance on long-term visibility for 2027 and beyond.

2nm yields and mass production pace

2nm is the core variable determining TSMC's profitability over the next three to five years, and it is also the most noteworthy technical aspect of this investor conference.

Currently, N2 has entered volume production simultaneously in Hsinchu and Kaohsiung in the fourth quarter of 2025, driven by strong customer demand, with tape-outs reaching 1.5 times that of 3nm during the same period. Wafer defect density achieved targets two quarters ahead of schedule, with a yield learning curve superior to N3, and first-year wafer output 45% higher than N3's during the same period. Goldman Sachs estimates that by the end of 2027, monthly 2nm capacity will reach 140,000 wafers, while 3nm will expand to 200,000 wafers.

Three points to focus on: whether yields continue to exceed expectations, which directly determines initial profitability; whether capacity targets are revised upward due to robust demand; and how management plans to cope with the N2 initial ramp-up, which is expected to dilute gross margin by 2% to 3% in the second half of 2026.

When will the CoWoS packaging capacity gap narrow?

CoWoS packaging is currently the biggest physical bottleneck for AI chip mass production. TSMC Chairman C.C. Wei previously stated that CoWoS is the current mainstay packaging solution.

TSMC's monthly CoWoS capacity is expected to reach 120,000 to 140,000 wafers by the end of 2026, climbing further to approximately 170,000 wafers in 2027. Combined with the 50,000 to 60,000 wafers of new capacity from OSAT partners, the entire industry's monthly capacity could approach 200,000 wafers. Supply chain sources reveal that the CoWoS supply-demand gap is expected to narrow from the current ~20% to about 10% by the end of 2026, with further improvement expected in 2027.

Additionally, TSMC has purchased a second large plot of land in Arizona, USA, to reserve flexibility for advanced packaging capacity. How management balances in-house capacity with outsourced assembly and testing is key to assessing the pace at which capacity bottlenecks will ease.

Costs and progress of overseas expansion

TSMC is expanding its manufacturing operations in the US, Japan, and Germany, and plans to build 4 new fabs and 2 advanced packaging plants in Taiwan in 2026, forming a layout of "6 domestic fabs and 3 major overseas bases."

Of note is whether there are any changes in stance during this investor conference, following TSMC CFO Wendell Huang's previous statement that "the most cutting-edge production will still remain in Taiwan, and shifting the entire ecosystem would take five years or more"; and whether management has concrete cost-control solutions for the 3% to 4% dilution of gross margin by overseas fabs in their early stages.

Can the gross margin and pricing power hold up?

This is the core financial variable determining whether TSMC's valuation baseline can move upward.

Goldman Sachs expects that, driven by better pricing, an improved product mix, and sustained high capacity utilization, TSMC's gross margins for 2026 to 2028 will reach 66.9%, 66.8%, and 67.3%, respectively. The key lies in whether management confirms that the 5% to 10% price hikes for advanced nodes will be implemented in 2026, and whether the medium-to-long-term gross margin target of 56% or above remains sustainable.

Institutions such as Citigroup, Goldman Sachs, and UBS have raised their target prices on the eve of the earnings conference. The trend of AI demand broadening is clear, 2nm yields have exceeded expectations, and the CoWoS capacity gap is gradually narrowing. However, what remains to be verified includes: whether full-year revenue guidance will be revised upward again, whether the gross margin dilution effect of N2 can be managed, and whether costs at overseas fabs are converging as expected.

Risk Warning: Market expectations for TSMC are already at a high level, with Q3 revenue expected to grow 10% to 15% quarter-on-quarter and gross margin potentially challenging 69%. If the guidance from the earnings conference only meets expectations without exceeding the most optimistic assumptions, the stock price may experience a "sell-the-news" style pullback. Citigroup's NT$3,800 target price is built on three assumptions: the continuous broadening of AI demand, the continuation of wafer price hikes, and capacity expansion landing as scheduled. Any marginal deterioration in any of these assumptions will put pressure on the realization of the target price.

This content was translated using AI and reviewed for clarity. It is for informational purposes only.