24H | Intel Jumps 6.8% as It Aims for '10x Growth in 5–10 Years,' Betting on Advanced Packaging, Glass Substrates, and Synthetic Diamonds

Intel CEO Lip-Bu Tan stated that his return target for Intel is "a tenfold increase within five to ten years," and he is systematically restructuring Intel's technology roadmap around advanced packaging, novel semiconductor materials, and next-generation substrate technologies.

Shares of Intel jumped 6.8% in overnight trading.

In a recent podcast episode, Tan elaborated on his strategy for transforming Intel: after stabilizing the balance sheet and streamlining the product portfolio, he is now focusing investments on advanced packaging technology EMIB, glass substrates, and new materials such as gallium nitride (GaN), silicon carbide (SiC), indium phosphide (InP), and synthetic diamond to address the challenges posed by the physical limits of traditional process node scaling. He also noted that the surge in agent AI and inference workloads is driving a strong rebound in CPU demand, with the CPU-to-GPU ratio in data center servers shifting from the historical 1:8 toward 1:4 or even lower.

Tan said that Intel has already delivered approximately a sixfold return to shareholders over the past 14 months, but "this is just the beginning." He expects that by 2030–2032, the market will begin to fully recognize Intel’s potential—not only in its traditional PC client business but also in emerging markets such as edge computing, physical AI, and agent AI.

In his view, if Intel can effectively integrate its XPU strategy, advanced packaging capabilities, and foundry services, it will be able to deliver customized chip solutions for diverse workloads—a long-term strategic direction he has set for the company.