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US Storage Stocks Rebound Pre-Market as Micron, SanDisk, Western Digital, and Seagate Gain

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AuthorAlan Long
Oct 19, 2026 9:26 AM

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US memory stocks, including Micron, SanDisk, Western Digital, and Seagate, rebounded in pre-market trading following recent pullbacks driven by AI financing and competition concerns. The recovery aligns with a broader tech sector bounce and a 1.3% rise in Nasdaq 100 futures. Meanwhile, Nvidia's reported request for TSMC 3nm-based next-gen HBM products underscores ongoing technological upgrades. Investor focus now shifts to upcoming earnings catalysts, particularly Western Digital's October 22 report, which will provide critical insights into AI-driven memory demand, pricing conditions, and forward-looking financial guidance.

AI-generated summary

TradingKey - On October 19, US memory stocks rallied across the board in pre-market trading. Following last week's continuous pullbacks, Micron Technology (MU), SanDisk (SNDK), Western Digital (WDC), and Seagate Technology (STX) all rose noticeably, supported by a broader recovery in tech stocks.

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Micron pre-market stock price chart, Source: FUTUBULL

As of writing, Micron rose about 2.7%, SanDisk gained around 3.8%, and both Western Digital and Seagate climbed about 2%; SK Hynix's US ADR (SKHY) gained approximately 3.8%. Meanwhile, Nasdaq 100 Index futures climbed about 1.3%, with AI and semiconductor sectors that had previously faced heavy sell-offs staging a rebound.

Last Friday, Micron closed down 5.63%, SanDisk dropped 6.85%, Western Digital fell 6.86%, and Seagate dropped even further by 7.50%. Over the past week, mounting market concerns over AI data center financing risks, capital expenditure sustainability, and technical progress by Chinese memory maker CXMT led to concentrated profit-taking in memory stocks that had previously posted strong gains.

On the news front, market attention remains focused on AI server demand for DRAM, HBM, NAND, and high-capacity hard drives. Latest reports indicate that Nvidia has requested Samsung, SK Hynix, and Micron to use TSMC's 3nm process to manufacture base dies for their next-generation custom HBM products, reflecting ongoing upgrades in next-generation AI memory products.

The memory sector will face another earnings catalyst this week, as Western Digital is set to report earnings on October 22. The market will focus closely on AI data center memory demand, HDD pricing and supply conditions, and the company's financial guidance for the coming quarters.

This content was translated using AI and reviewed for clarity. It is for informational purposes only.

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Disclaimer: The content of this article solely represents the author's personal opinions and does not reflect the official stance of Tradingkey. It should not be considered as investment advice. The article is intended for reference purposes only, and readers should not base any investment decisions solely on its content. Tradingkey bears no responsibility for any trading outcomes resulting from reliance on this article. Furthermore, Tradingkey cannot guarantee the accuracy of the article's content. Before making any investment decisions, it is advisable to consult an independent financial advisor to fully understand the associated risks.

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