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Broadcom Discloses AI Computing Power Expansion Plan: Anthropic, OpenAI and Meta to Massively Deploy XPUs in the Next Two Years

TradingKey

AuthorAlan Long

Sep 3, 2026 1:42 AM

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Broadcom expects demand for its custom AI accelerators to accelerate between 2027 and 2028, driven by major infrastructure expansions from Anthropic, OpenAI, and Meta. Anthropic will deploy 1GW in 2026, scaling to 10GW by 2028 to become Broadcom’s largest XPU customer. OpenAI has begun shipping its first-generation Jalapeño chip, targeting over 5GW of deployments by 2028. Meanwhile, Broadcom will deliver three generations of MTIA accelerators to Meta through 2027, reaching 3GW in cumulative deployments by 2028. These strategic partnerships underscore Broadcom’s solid positioning in the high-growth AI compute market.

AI-generated summary

TradingKey - Broadcom (AVGO) recently disclosed AI compute deployment plans for Anthropic, OpenAI, and Meta (META), expecting demand for its custom AI accelerators (XPUs) to further accelerate between 2027 and 2028 as major AI companies continue to expand infrastructure investments.

Broadcom CEO Hock Tan stated during the latest earnings call that Anthropic will deploy 1GW of Ironwood compute capacity in 2026, deploy a further 5GW of TPU v8i in 2027, and plans to add another 10GW in 2028. Based on this timeline, Anthropic is expected to become Broadcom's largest XPU customer in 2027 and retain that position in 2028.

Regarding OpenAI, Jalapeño—the first-generation custom AI chip co-developed with Broadcom—has begun shipping, with plans to deploy 1.3GW of compute capacity in 2027. By 2028, OpenAI is expected to deploy over 5GW of Jalapeño and next-generation XPUs, with the potential to become Broadcom's second-largest XPU customer. The two companies have already begun developing second- and third-generation custom AI chips.

Meta's custom chip program is also making progress. Broadcom stated that it will deliver three generations of MTIA AI accelerators to Meta between now and the end of 2027, with cumulative deployment expected to reach 3GW by 2028. The two parties previously announced a multi-year partnership to jointly develop multiple generations of MTIA chips and supporting AI networking infrastructure.

This content was translated using AI and reviewed for clarity. It is for informational purposes only.

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Disclaimer: The content of this article solely represents the author's personal opinions and does not reflect the official stance of Tradingkey. It should not be considered as investment advice. The article is intended for reference purposes only, and readers should not base any investment decisions solely on its content. Tradingkey bears no responsibility for any trading outcomes resulting from reliance on this article. Furthermore, Tradingkey cannot guarantee the accuracy of the article's content. Before making any investment decisions, it is advisable to consult an independent financial advisor to fully understand the associated risks.

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